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Intel launches new Lakefield hybrid CPUs for foldable and dual-screen devices

The new Lakefield processors are aimed at delivering powerful performance across tablets, dual-screen and foldable devices.

Sushant Talwar | June 11, 2020 | Updated 10:33 IST
Intel

Highlights

  • Intel has launched new Hybrid CPUs for foldable devices
  • The company has launched two new CPUs under the line-up for now
  • The CPUs come with Intel's Hybrid technology

Intel has launched two new Lakefield processors -- i5-L16G7 and i3-L13G4 -- with support for Intel Hybrid Technology. The new processors are claimed to leverage Intel's Foveros 3D packaging technology and feature a hybrid CPU architecture for power and performance scalability. The new Lakefield processors are aimed at delivering powerful performance across single, dual and foldable screen devices.

Lakefield processors are the smallest to deliver Intel Core performance and offer full Windows compatibility across "productivity and content creation experiences for ultra-light and innovative form factors."

"Intel Core processors with Intel Hybrid Technology are the touchstone of Intel's vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel's deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future", said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.

Intel claims the new processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56 per cent smaller package area for up to 47 per cent smaller board size and extended battery life, providing OEMs more flexibility in form factor design.

Interestingly, two processors from this line-up have already been announced. These include the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 and expected to ship this year, and the Intel-based Samsung Galaxy Book S expected in select markets starting in June.

The processor are designed on the Foveros 3D stacking technology, which helps them stay very lean in size -- 12x12x1 mm. This Intel claims is done by stacking two logic dies and two layers of DRAM in three dimensions, thereby also eliminating the need for external memory.

The Lakefield processors also bring Gen11 graphics, which is being claimed to be the biggest leap in graphics for Intel processor-based 7-watt systems.

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