Semicon 2.0 Approved: India To Design Strategic Chips And Build New Fabs

Union Minister Ashwini Vaishnaw said Semicon 2.0 will strengthen India’s semiconductor ambitions through six key pillars, beginning with chip design. He said chips required for strategic sectors, including drones, missiles, aircraft and tanks, will be designed in India. The programme also proposes new silicon fabs, display and compound semiconductor fabs, while expanding the ATMP and OSAT ecosystem already taking shape in the country. Vaishnaw highlighted India’s growing partnerships with the US, EU, Japan, Singapore, Netherlands and Germany for co-development, co-production and technology collaboration, as global semiconductor companies show strong interest in entering and investing in India’s market over coming years.